| Mfg. Specs | Remarks | |
|---|---|---|
| Hole Diameter | - MIN Ø 20 ㎛ | - Ceramics |
| True Position | - Micro-Hole Diameter: ± 5 ㎛ | - Varies depending on thickness and hole size |
WAFER LEVEL TEST SOCKET
WLCSP stands for Wafer-Level Chip-Scale Package, a type of integrated |cir cuit package designed to be mounted dir ectly on a printed circuit board |(PCB) without a board.
주요사항
LOGIC TEST SOCKET
|
Spring Force |
Initial Force
Recommended Stroke
Full Stroke
|
2.5gf
0.70mm @ 15.5gf
0.90mm @ 19.0gf
|
|
Material Spec |
Barrel
Top Plunger
Bottom Plunger
Spring
|
PBT / Gold plated
SK4 / Gold plated
Becu / Gold plated
SWP / Gold plated
|
|
Mechanical Spec |
Pointing Accuracy
Operating Temperature
Spring Life Expectancy
|
± 50um
-25°C ~ +125°C
200K <
|
|
Electrical Spec |
DC Resistance (Avg)
Current Rating
Band Width
Self Inductance
Capacitance
|
<80mΩ
2 amps continuous
-1 dB @ 18.11 GHz
0.93nH
0.52pF
|
* 항목이 많으면 좌우 스크롤이 가능합니다.
WAFER LEVEL TEST SOCKET
WLCSP stands for Wafer-Level Chip-Scale Package, a type of integrated |cir cuit package designed to be mounted dir ectly on a printed circuit board |(PCB) without a board.
주요사항