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WAFER LEVEL TEST SOCKET

WLCSP stands for Wafer-Level Chip-Scale Package, a type of integrated |cir cuit package designed to be mounted dir ectly on a printed circuit board |(PCB) without a board.

주요사항

최소 pitch 0.08mm
하중: 3gf~ tgf
Socket 소재:엔지니어링 플라스틱과 세라믹
낮은 단가 제작 가능
뛰어난 내구성 (100만 사이클 이상)
빠른 납기일정:2주이내
접촉저항: 10mΩ to 100mΩ

LOGIC TEST SOCKET

Spring Force	Initial Force Recommended Stroke Full Stroke	2.5gf 0.70mm @ 15.5gf 0.90mm @ 19.0gf
Material Spec	Barrel Top Plunger Bottom Plunger Spring	PBT / Gold plated SK4 / Gold plated Becu / Gold plated SWP / Gold plated
Mechanical Spec	Pointing Accuracy Operating Temperature Spring Life Expectancy	± 50um -25°C ~ +125°C 200K <
Electrical Spec	DC Resistance (Avg) Current Rating Band Width Self Inductance Capacitance	<80mΩ 2 amps continuous -1 dB @ 18.11 GHz 0.93nH 0.52pF

* 항목이 많으면 좌우 스크롤이 가능합니다.

WAFER LEVEL TEST SOCKET

WLCSP stands for Wafer-Level Chip-Scale Package, a type of integrated |cir cuit package designed to be mounted dir ectly on a printed circuit board |(PCB) without a board.

주요사항

최소 pitch 0.08mm
하중: 3gf~ tgf
Socket 소재:엔지니어링 플라스틱과 세라믹
낮은 단가 제작 가능
뛰어난 내구성 (100만 사이클 이상)
빠른 납기일정:2주이내
접촉저항: 10mΩ to 100mΩ