메뉴 건너뛰기

Test Socket

Test socket

Semiconductor test sockets serve as a critical interface connecting devices to test systems, demanding highly stable contact performance and exceptional reliability. We design and manufacture custom test sockets optimized for diverse testing environments, helping our customers enhance product quality and maximize testing efficiency.

Core Strengths

 
High Pin Count & Large Body Socket Machining Leveraging our extensive experience in manufacturing high-pin-count and large-package sockets, we reliably produce components of various sizes and complex structures (Max 240 x 240mm)
 
 
Material Versatility We are capable of processing a wide range of engineering plastics and metallic materials, providing optimized material solutions tailored to each customer's specific testing environment.
 
 
Fine Feature Machining Our precision machining technology enables the realization of fine pitches and micro-features, effectively supporting high-density semiconductor packages.
Meldin
Torlon
Torlon
PEEK & Meldin
ULTEM
CERAMIC
SUS

WAFER LEVEL TEST SOCKET

 

WLCSP stands for Wafer-Level Chip-Scale Package, a type of integrated |cir cuit package designed to be mounted dir ectly on a printed circuit board |(PCB) without a board.

주요사항

  • 최소 pitch 0.08mm
  • 하중: 3gf~ tgf
  • Socket 소재:엔지니어링 플라스틱과 세라믹
  • 낮은 단가 제작 가능
  • 뛰어난 내구성 (100만 사이클 이상)
  • 빠른 납기일정:2주이내
  • 접촉저항: 10mΩ to 100mΩ

LOGIC TEST SOCKET

Spring Force

Initial Force
Recommended Stroke
Full Stroke
2.5gf
0.70mm @ 15.5gf
0.90mm @ 19.0gf

Material Spec

Barrel
Top Plunger
Bottom Plunger
Spring
PBT / Gold plated
SK4 / Gold plated
Becu / Gold plated
SWP / Gold plated

Mechanical Spec

Pointing Accuracy
Operating Temperature
Spring Life Expectancy
± 50um
-25°C ~ +125°C
200K <

Electrical Spec

DC Resistance (Avg)
Current Rating
Band Width
Self Inductance
Capacitance
<80mΩ
2 amps continuous
-1 dB @ 18.11 GHz
0.93nH
0.52pF

* 항목이 많으면 좌우 스크롤이 가능합니다.

WAFER LEVEL TEST SOCKET

 

WLCSP stands for Wafer-Level Chip-Scale Package, a type of integrated |cir cuit package designed to be mounted dir ectly on a printed circuit board |(PCB) without a board.

주요사항

  • 최소 pitch 0.08mm
  • 하중: 3gf~ tgf
  • Socket 소재:엔지니어링 플라스틱과 세라믹
  • 낮은 단가 제작 가능
  • 뛰어난 내구성 (100만 사이클 이상)
  • 빠른 납기일정:2주이내
  • 접촉저항: 10mΩ to 100mΩ